Memory cell operation

ABSTRACT

The present disclosure includes memory devices and systems having memory cells, as well as methods for operating the memory cells. One or more methods for operating memory cells includes determining age information for a portion of the memory cells and communicating a command set for the portion of the memory cells, the command set including the age information.

PRIORITY INFORMATION

This application is a Continuation of, and claims priority to, U.S.application Ser. No. 13/485,226, filed May 31, 2012, to be issued asU.S. Pat. No. 8,402,207 on Mar. 19, 2013, which is a Continuation of,and claims priority to, U.S. application Ser. No. 12/388,366, filed Feb.18, 2009, issued as U.S. Pat. No. 8,195,899 on Jun. 5, 2012, whichclaims priority to a China Patent Application Serial No. 200810211462.2,filed Sep. 26, 2008, and a Taiwan Patent Application Serial No.097137512, filed Sep. 30, 2008, the specifications of which are herebyincorporated by reference.

TECHNICAL FIELD

The present disclosure relates to semiconductors and semiconductormemory devices. More particularly, in one or more embodiments thepresent disclosure relates to operating a memory device.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits in computers or other electronic devices. There aremany different types of memory including random-access memory (RAM),read only memory (ROM), dynamic random access memory (DRAM), synchronousdynamic random access memory (SDRAM), and flash memory, among others.

Flash memory devices are utilized as non-volatile memory for a widerange of electronic applications. Flash memory devices typically use aone-transistor memory cell that allows for high memory densities, highreliability, and low power consumption.

Uses for flash memory include memory for personal computers such as aportable memory stick and a solid state drive (SSD), personal digitalassistants (PDAs), digital cameras, and cellular telephones, portablemusic players (e.g., MP3 players), and movie players, among others.Program code and system data, such as a basic input/output system(BIOS), are typically stored in flash memory devices. This informationcan be used in personal computer systems, and other electronic devices.

Two common types of flash memory array architectures are the “NAND” and“NOR” architectures, so called for the logical form in which the basicmemory cell configuration of each is arranged. The floating gate memorycells of the memory array are typically arranged in a matrix. The gatesof each floating gate memory cell in a “row” of the array are coupled toan access line (one example which is a “word line”). In a NORarchitecture, the drains of each memory cell in a “column” of the arrayare coupled to a data line (one example which is a “bit line”). In aNAND architecture, the drain of individual memory cells is not directlycoupled to a bit line. Instead, the memory cells of the array arecoupled together in series, source to drain, between a source line and abit line.

The NOR architecture floating gate memory array is accessed through arow decoder activating a row of floating gate memory cells by selectingthe word line coupled to their gates. The row of selected memory cellsthen place their data values on the bit lines by causing differentcurrents to flow depending on the state to which a particular cell isprogrammed.

The NAND architecture memory array is also accessed through a rowdecoder activating a row of memory cells by selecting the word linecoupled to their gates. A high bias voltage is applied to a select gatedrain line SG(D). In addition, the word lines coupled to the gates ofthe unselected memory cells of each group are driven (e.g., at Vpass) tooperate the unselected memory cells of each group as pass transistors sothat they pass current in a manner that is unrestricted by their storeddata values. Current then flows from the source line to the column bitline through each series coupled group, restricted only by the selectedmemory cells of each group. This places the current encoded data valuesof the row of selected memory cells on the bit lines.

Memory cells can be programmed to an intended state. That is, electriccharge can be placed on or removed from the floating gate of a memorycell to put the cell into a number of programmed states. For example, asingle level cell (SLC) can represent one of two programmed states(e.g., 1 or 0). The memory cell is commonly referred to as being“erased” when representing the programmed state corresponding to chargebeing removed from the floating gate.

Flash memory cells can also represent one of more than two programmedstates, such as to represent more than two binary digits (e.g., 1111,0111, 0011, 1011, 1001, 0001, 0101, 1101, 1100, 0100, 0000, 1000, 1010,0010, 0110, and 1110). Such cells may be referred to as multi statememory cells, multi-digit cells, or multilevel cells (MLCs). MLCs canallow the manufacture of higher density memories without increasing thenumber of memory cells since each cell can represent more than onebinary digit (e.g., more than one bit). MLCs can, in some embodiments,each represent one of more than two programmed states (e.g., a cellcapable of representing four digits can be put into sixteen programmedstates). For some MLCs, one of the sixteen programmed states can be anerased state, while the other states are programmed states.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic of a portion of a non-volatile memory array inaccordance with one or more embodiments of the present disclosure.

FIG. 2 is a functional block diagram of an electronic system having atleast one memory device operated in accordance with one or moreembodiments of the present disclosure.

FIG. 3 is a functional block diagram of a memory device in accordancewith one or more embodiments of the present disclosure.

FIG. 4 shows timing waveforms associated with operating memory cells inaccordance with one or more embodiments of the present disclosure.

FIG. 5A is a table illustrating an address data arrangement organizedinto 5 cycles in accordance with one or more embodiments of the presentdisclosure.

FIG. 5B is a table illustrating an address data arrangement organizedinto 6 cycles in accordance with one or more embodiments of the presentdisclosure.

FIG. 6 is a functional block diagram of a memory module having at leastone memory device in accordance with one or more embodiments of thepresent disclosure.

DETAILED DESCRIPTION

The present disclosure includes memory devices and systems having memorycells, as well as methods for operating the memory cells. One or moremethods for operating memory cells includes determining age informationfor a portion of the memory cells and communicating a command set forthe portion of the memory cells, the command set including the ageinformation.

In the following detailed description of the present disclosure,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration how one or more embodimentsof the present disclosure may be practiced. These embodiments aredescribed in sufficient detail to enable those of ordinary skill in theart to practice the embodiments of this disclosure, and it is to beunderstood that other embodiments may be utilized and that process,electrical, and/or structural changes may be made without departing fromthe extent of the present disclosure.

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits. For example, 220 may referenceelement “20” in FIG. 2, and a similar element may be referenced as 320in FIG. 3.

As used herein, the designators “N” and “M,” particularly with respectto reference numerals in the drawings, indicate that a number of theparticular feature so designated can be included with one or moreembodiments of the present disclosure. As will be appreciated, elementsshown in the various embodiments herein can be added, exchanged, and/oreliminated so as to provide a number of additional embodiments of thepresent disclosure. In addition, as will be appreciated, the proportionand the relative scale of the elements provided in the figures areintended to illustrate the embodiments of the present disclosure, andshould not be taken in a limiting sense.

In a binary system, a “bit” often represents one unit of data. Althoughthe term bit is used herein, embodiments of the present disclosure arenot limited to a binary system. One skilled in the art will appreciatethat embodiments of the present disclosure may be implemented in othermulti-state systems, and that “bit” as used herein may be interpreted asthe smallest “unit” of data or data element (e.g., of a word of datacommunicated across a communication interface).

The quantity of program/erase cycles performed on a number of memorycells is referred to herein as “wear cycles.” Wear cycles are also knownas “process cycles,” an “experience count,” or “hot count.” Wear cycleinformation refers to a representation of a particular quantity ofprogram/erase operations. Wear cycle information may be a number, orother encoded value.

As used herein, “wear state” denotes a classification encompassing oneor more wear cycles. A wear state may indicate one of several relativeoperating conditions (e.g., “young,” “old”) and may be represented by astatus flag having a value of 1 or 0, with the boundary between two wearstates being some quantity of wear cycles (e.g., 100,000). A wear statemay be a wear cycle quantity (e.g., each wear cycle value defines aparticular wear state) or a wear state may include a range of wearcycles (e.g., from 1 to 1000 is a first wear state, from 1001 to 10,000is a second wear state). According to one embodiment of the presentinvention, the useful life of a memory device may be classified into anumber of wear states, for example, sixteen wear states. However,embodiments are not limited to any particular quantity of wear states.

A wear state may refer to a classification with respect to futureoperations (e.g., a state enabling high reliability or a state enablinghigh speed operations) where a particular state tends to cause thememory cells to expend useful life at a different rate. Thus, wear statemay define a set of operating characteristics, or properties,corresponding to a rate at which memory cells may wear out when operatedin the particular wear state. Used in this manner, wear state is similarto an operating mode that impacts how memory cells will consume usefullife. Additionally, a wear state may be a classification, referring toan amount of useful life of a memory cell already expended. A wear statemay also refer to a classification with respect to past operations(e.g., a quantity or range of wear cycles to which memory cells havealready been operated).

Thus, wear cycles and wear state may represent an “age” of the memorycells (e.g., a percentage of useful life, amount of useful life) alreadyused up. The term “age” can refer to memory cell useful life, ratherthan a chronological measurement. Useful life can refer to a fraction ofexpected reliable operations of one or more memory cells. Thus, age canrefer to an accumulation, or use, of a certain number of memory cellwear cycles, or a certain portion of expected reliable operations. Wearstate information refers to a representation of a particular wear state.

Operating a memory cell, as used herein, includes reading from, writingto, or erasing the memory cell. The operation of placing a memory cellin an intended state is referred to herein as “programming,” andincludes both writing and erasing the memory cell (i.e., the memory cellmay be programmed to an erased state).

According to one or more embodiments of the present disclosure, a memoryaccess device (e.g., a processor, controller, firmware, etc.) locatedinternal or external to a memory device, is capable of determining(e.g., selecting, setting, adjusting, computing, changing, clearing,communicating, adapting, deriving, defining, utilizing, modifying,applying, etc.) a quantity of wear cycles, and/or a wear state (e.g.,recording wear cycles, counting operations of the memory device as theyoccur, tracking the operations of the memory device it initiates,evaluating the memory device characteristics corresponding to a wearstate, etc.)

According to one or more embodiments of the present disclosure, a memoryaccess device may be configured to provide wear cycle information to thememory device with each read and program (e.g., write, erase) operation.The memory device control circuitry (e.g., control logic) may beprogrammed to compensate for memory device performance changescorresponding to the wear cycle information. The memory device mayreceive the wear cycle information and determine one or more operatingparameters (e.g., a value, characteristic) in response to the wear cycleinformation.

For example, the memory device may be programmed with a Vt drift curveas a function of wear cycles. Control circuitry (e.g., control logic) onthe memory device may be configured to determine one or more memory celloperating parameters in response to receipt of the wear cycleinformation. Examples of operating parameters which may be determinedinclude a programming pulse voltage magnitude, a programming pulseduration, a programming pulse frequency, and the quantity of programmingpulses, among others.

According to one or more embodiments of the present disclosure, a memoryaccess device may be configured to provide wear state information to thememory device with each read, program, and/or erase operation. Thememory device control circuitry (e.g., control logic) may be programmedto compensate for memory device performance changes corresponding to thewear state information. The memory device may receive the wear stateinformation and determine one or more operating parameters (e.g., avalue or characteristic thereof) in response to the wear stateinformation.

Similar to the description above with respect to determining one or moreoperating parameters in response to wear cycle information, the memorydevice may be programmed with a Vt drift curve as a function of wearstate. Control circuitry (e.g., control logic) on the memory device maybe configured to determine one or more memory cell operating parametersin response to receipt of the wear state information. Examples ofoperating parameters which may be determined in response to wear stateinformation are as set forth above in response to wear cycleinformation.

Memory cells, such as SLCs and MLCs, store one or more units of data oneach cell by using different threshold voltage (Vt) levels, eachrepresenting one of a number of programmed states. The differencebetween adjacent Vt levels may be very small for a MLC memory device ascompared to a SLC memory device. The reduced margins between adjacent Vtlevels (e.g., representing different programmed states) can increase thedifficulty associated with distinguishing between adjacent programmedstates, which can lead to problems such as reduced data read and/or dataretrieval reliability.

In a NAND array architecture, the state of a selected memory cell isdetermined by sensing a current or voltage variation associated with aparticular bit line to which the selected cell is coupled. Since thememory cells in a NAND array architecture are connected in series, thecurrent associated with reading the selected cell passes through severalother unselected cells (e.g., cells biased so as to be in a conductivestate) coupled to the bit line. Various degradation mechanisms existwhich can result in erroneous data reads of non-volatile memory cells.The cell current associated with a string of memory cells (e.g., cellscoupled in series between a source line and a sense line) can becomedegraded over time. Memory cells affected by current degradationmechanisms can become unreliable (e.g., the logical value read from thecells may not necessarily be the logical value written to the cells).

Program/erase cycling is one factor which can affect memory cellperformance. Several mechanisms are known which affect performance ofcharge storage (e.g., floating gate) type devices over time and use. Forexample, trapped charge can gradually accumulate between adjacent memorycells, resulting in Vt drift. Other types of memory cells may beaffected by other degradation mechanisms that occur with use (e.g., wearcycling).

The useful life of a memory cell (which is often referred to asendurance) is dependent on the difference in a cell's threshold voltage,Vt, between programmed states, including where one of the programmedstates represents the memory cell being erased. As the number ofprogram/erase cycles (i.e., wear cycles) increases, cell current candecrease in some memory cells, resulting in subsequent data read errors.Increasing program/erase cycling is also associated with changes inmemory programming performance. For example, programming speed mayincrease, and erase speed may decrease. Other changes in operationalattributes may also occur. Faster programming speed may make theaffected cells more susceptible to over-programming. For instance, whena voltage is applied to a particular cell, the conditioning of the cellmay cause the cell to be over charged, thereby causing further celldegradation and an incorrect result when read and/or verified.

Memory devices can be programmed with various amounts of data at onetime. A number of memory cells of a memory device may be programmed atone time, for example a page of data. A number of memory cells of amemory device may be erased at the same time, for example a block ofdata. A block of data can include a number of data pages. A memory planecan include a number of data blocks on a given die. Some memory deviceshave multiple planes per die.

While memory cells may be programmed individually or by page, memorycells are generally erased in groups, such as in blocks or otherfunctional groups, as will be appreciated by those possessing ordinaryskill in the art. A block of memory cells may be erased by setting theerase voltage parameters (e.g., Verase magnitude) and issuing a quantityof erase pulses having certain erase voltage parameters (e.g., quantity,duration, magnitude changes from one pulse to another, etc.) Subsequentto an erase attempt operation, a erase verification may be performed todetermine if the group of memory cells has been satisfactorily erased.If not, additional erase pulses may be issued, with periodic eraseverification being performed until satisfactory erasure is accomplishedwith respect to a particular threshold voltage (Vt).

The threshold voltage of the memory cells comprising a non-volatilememory device (e.g., a NAND flash device) can shift as the quantity ofwear cycles increases. Eventually, Vt can drift out of a boundaryinitially defining a given state (e.g., logical 1 or 0) such that thestate can no longer be reliably ascertained. When reliability inaccurately determining memory cell state for a block of memory cellsdegrades beyond limits, the block may be considered worn out, and may beexcluded from further use (e.g., “retired”).

A memory device may not be age aware. That is, the memory device itselfmay not track wear cycles, and thus may not recognize for example, thatthe Vt of certain memory cells, or groups of memory cells, are driftingas the block ages (e.g., as the quantity of wear cycles for that blockof memory cells increases). Therefore, the memory device may not accountfor, or operate to accommodate, the Vt drift of certain memory cells, orgroups of memory cells (e.g., blocks).

According to one or more embodiments of the present disclosure, the wearcycles associated with a memory device, and/or with a number of memorycells (e.g., block) within the memory device, can be monitored, andinformation corresponding to the age (e.g., wear cycle information, wearstate information) of a particular portion of memory can be communicatedto the memory device.

For example, wear cycles can be monitored by firmware implemented in amemory access device, or by logic instructions executed by the memoryaccess device. Wear cycle information can be communicated to the memorydevice when operating those particular memory cells. While a NANDarchitecture flash array device is illustrated and discussed,embodiments of the present disclosure are not so limited, and one ofordinary skill in the art will appreciate that embodiments may beimplemented using other memory device architectures, types,arrangements, and configurations.

FIG. 1 is a schematic of a portion of a non-volatile memory array 100.The embodiment of FIG. 1 illustrates a NAND architecture non-volatilememory. However, embodiments described herein are not limited to thisexample. As shown in FIG. 1, the memory array 100 includes access lines(e.g., “word lines”) 105-1, . . . , 105-N, and intersecting data lines(e.g., “bit lines”) 107-1, . . . , 107-M. For ease of addressing in thedigital environment, the number of word lines 105-1, . . . , 105-N andthe number of bit lines 107-1, . . . , 107-M are typically each somepower of two (e.g., 256 word lines by 4,096 bit lines).

Memory array 100 includes NAND strings 109-1, . . . , 109-M. Each NANDstring includes non-volatile memory cells 111-1, . . . , 111-N, eachlocated at an intersection of a word line (e.g., 105-1, . . . , 105-N)and a local bit line (e.g., 107-1, . . . , 107-M). The non-volatilememory cells 111-1, . . . , 111-N of each NAND string 109-1, . . . ,109-M are connected in series source to drain between a source selectgate (SGS) (e.g., a field-effect transistor (FET) 113) and a drainselect gate (SGD) (e.g., FET 119). Source select gate 113 is located atthe intersection of a local bit line 107-1 and a source select line 117.The drain select gate 119 is located at the intersection of the localbit line 107-1 and a drain select line 115.

As shown in the embodiment illustrated in FIG. 1, a source of sourceselect gate 113 is connected to a common source line 123. The drain ofsource select gate 113 is connected to the source of the memory cell111-1 of the corresponding NAND string 109-1. The drain of drain selectgate 119 is connected to the local bit line 107-1 for the correspondingNAND string 109-1 at drain contact 121-1. The source of drain selectgate 119 is connected to the drain of the last memory cell 111-N (e.g.,a floating-gate transistor, of the corresponding NAND string 109-1).

In one or more embodiments, construction of non-volatile memory cells,111-1, . . . , 111-N, includes a source, a drain, a floating gate orother charge storage node, and a control gate. Non-volatile memorycells, 111-1, . . . , 111-N, have their control gates coupled to a wordline, 105-1, . . . , 105-N respectively. A column of the non-volatilememory cells, 111-1, . . . , 111-N, make up the NAND strings (e.g.,109-1, . . . , 109-M) those memory cells being commonly coupled to agiven local bit line (e.g., 107-1, . . . , 107-M respectively). A row ofthe non-volatile memory cells are those memory cells commonly coupled toa given word line (e.g., 105-1, . . . , 105-N). A NOR array architecturewould be similarly laid out except that the string of memory cells wouldbe coupled in parallel between the select gates.

As one of ordinary skill in the art will appreciate, subsets of cellscoupled to a selected word line (e.g., 105-1, . . . , 105-N) can beprogrammed and/or sensed together as a group. A programming operation,such as a write operation, can include applying a number of programpulses (e.g., 16V-20V) to a selected word line in order to increase thethreshold voltage (Vt) of selected cells to a particular program voltagelevel corresponding to an intended program state. Memory cells may beerased by programming to an erased state (e.g., to a erased programmingvoltage level).

A sensing operation, such as a read or program verify operation, caninclude sensing a voltage and/or current change of a bit line coupled toa selected cell in order to determine the state of the selected cell.The sensing operation can involve biasing a bit line (e.g., bit line107-1) associated with a selected memory cell at a voltage above a biasvoltage for a source line (e.g., source line 123) associated with theselected memory cell. A sensing operation could alternatively includepre-charging the bit line 107-1 followed with discharge when a selectedcell begins to conduct, and sensing the discharge.

Sensing the state of a selected cell can include applying a sensingvoltage to a selected word line, while biasing the unselected cells ofthe string at a voltage sufficient to place the unselected cells in aconducting state independent of the threshold voltage of the unselectedcells. The bit line corresponding to the selected cell being read and/orverified can be sensed to determine whether or not the selected cellconducts in response to the particular sensing voltage applied to theselected word line. For example, the state of a selected cell can bedetermined by the word line voltage at which the bit line currentreaches a predetermined reference current associated with a particularstate.

As one of ordinary skill in the art will appreciate, in a sensingoperation performed on a selected memory cell in a NAND string, theunselected memory cells of the string are biased so as to be in aconducting state. In such a sensing operation, the data stored in theselected cell can be based on the current and/or voltage sensed on thebit line corresponding to the string. For instance, the interpretedvalue of data stored in the selected cell can be based on whether thebit line current changes by a predetermined amount or reaches apredetermined level in a given time period.

When the selected cell is in a conductive state, current flows between asource line contact at one end of the string, and a bit line contact atthe other end of the string. As such, the current associated withsensing the selected cell is carried through each of the other cells inthe string, the diffused regions between cell stacks, and the selecttransistors.

FIG. 2 is a functional block diagram of an electronic system 201 (e.g.,memory system) having at least one memory device 203 operated inaccordance with one or more embodiments of the present disclosure.Memory system 201 includes a memory access device 205 (e.g., processor,firmware, etc.) coupled to the memory device 203. According to one ormore embodiments of the present disclosure, the memory device 203 is anon-volatile floating gate memory device such a NAND flash device.

The non-volatile memory device 203 includes a memory array 204 ofnon-volatile memory cells. The non-volatile memory device 203 and memoryaccess device 205, can be implemented as separate integrated circuits,or the processor 205 and the memory device 203 can be incorporated intothe same integrated circuit, chip, or package. The memory access device205 can be a discrete device (e.g., microprocessor) or some other typeof process circuitry implemented in firmware, such as anapplication-specific integrated circuit (ASIC).

I/O connections 227 and control connections 229 comprise a communicationinterface between the memory access device 205 and the memory device203. The embodiment of FIG. 2 includes address circuitry 243 to latchaddress signals provided over the I/O connections 227 through I/Ocontrol circuitry 218. Address signals are received and decoded by a rowdecoder 252 and a column decoder 250 to access the memory array 204. Inlight of the present disclosure, it will be appreciated by those skilledin the art that the number of address input connections depends on thedensity and architecture of the memory array 204 and that the number ofaddresses increases with both increased numbers of memory cells permemory array, an increased number of memory blocks and/or an increasednumber of memory arrays. The reader will also appreciate that moreaddress information may be needed to specify a particular portion of thememory array as the size of the memory array increases.

The memory device 203 senses data in the memory array 204 by sensingvoltage and/or current changes in the memory array columns usingsense/buffer circuitry, shown in FIG. 2 as the read/latch circuitry 253.The read/latch circuitry 253 can read and latch a page (e.g., a row) ofdata from the memory array 204. I/O control circuitry 218 is includedfor bi-directional data communication over the I/O connections 227 withthe memory access device 205. Write circuitry 255 is included to writedata to the memory array 204.

Control logic circuitry 220 decodes signals communicated by controlconnections 229 from the memory access device 205, such as thoseillustrated in FIG. 4. These signals can include chip signals, writeenable signals, and address latch signals (among others) that are usedto control the operations on the memory device 203, and of the memoryarray 204, including data sensing (e.g., reading) and data programming(e.g., writing, erasing).

The control logic circuitry 220 can send signals (e.g., commands) toselectively set particular registers and/or sections of registers, orlatch data in one or more registers. In one or more embodiments, thecontrol logic circuitry 220 is responsible for executing instructionsreceived from the memory access device 205 to perform certain operationson some portion of the memory cells of the memory array 204. The controllogic circuitry 220 can be a state machine, a sequencer, or some othertype of logic controller. It will be appreciated by those skilled in theart that additional circuitry and control signals can be communicated,and that the memory device detail of FIG. 2 has been reduced tofacilitate ease of illustration.

According to one or more embodiments of the present disclosure, a memoryaccess device 205 (e.g., processor, firmware) shown in FIG. 2 beingexternal to the memory device 203, determines (e.g., tracks, counts,records) a number of wear cycles performed on particular groups ofmemory cells within the memory array 204. For example, the memory accessdevice 205 may determine wear cycles for each block of memory cells inmemory array 204. After a quantity of wear cycles is determined for aportion of a memory device (e.g., a block) the memory access device maydetermine a wear state for the portion of the memory device 203, andcommunicate the wear state (as wear state information) to the memorydevice 203 as part of access information to operate that portion of thememory device 203.

Wear state may be determined by a number of techniques. Wear cycles maybe determined by the memory access device 205 each time one or moreoperations of a wear cycle occurs involving a portion of the memorydevice 203. For example, a counter may be incremented each time a blockof memory cells is programmed (e.g., written to, erased). Firmware maybe used to count or track wear cycle/state, the firmware being locatedwithin the memory access device 205 and in communication with aprocessor of the memory access device.

Operational performance of some portion of the memory device 203 canalso be measured by the memory access device 205, and age informationdetermined from the measured performance. For example, a dataarrangement (e.g., table, function) may be determined by testing of asimilarly-manufactured memory device, and may include measured operatingperformance characteristics related to age (e.g., a range of wearcycles, a wear state). According to one specific example, the ageinformation of a memory device may be determined by measuring thequantity of erase pulses needed to accomplish a verified erasure, whereprior testing indicated that quantity of erase pulses needed increaseswith memory device wear cycles.

As previously discussed, threshold voltage, Vt, drifts as the quantityof wear cycles for a memory cell increase. Thus, Vt drift may beexperimentally determined for memory cells as a function of memory cellage (e.g., wear cycles, wear state), and a Vt drift curve developed. TheVt drift curve may then be used to characterize the performance ofsimilar memory cells. For example, predetermined Vt drift curveinformation may be stored in a portion of a memory device as a dataarrangement (e.g., lookup table, computation, etc.). Given the memorycell age (e.g., wear cycle information, wear state information)operating parameters may be determined to accommodate the expected Vtdrift, or to achieve some other operational performance in view of theexpected Vt drift. According to one or more embodiments, operatingparameters may be determined to minimize the expected Vt drift for aparticular age of memory cells.

A data arrangement characterizing the operating performance of thememory device 203, and relating at least one operating parameter to ageinformation (e.g., wear cycle information, wear state information), maybe stored in the memory device 203 itself, or programmed into firmware(e.g., control logic circuitry 220) on the memory device. Upon receivingage information from the memory access device 205 (e.g., wear cycleinformation, wear state information) control logic 220 may determine atleast one operating parameter for one or more memory cells beingoperated on the memory device 203 (e.g., by selecting a value of atleast one operating parameter, by selecting a change to a value of atleast one operating parameter, by computing a value of at least oneoperating parameter, by computing a change to a value of at least oneoperating parameter) from the data arrangement stored in the memorydevice 203.

FIG. 3 is a functional block diagram of a memory device 303 inaccordance with one or more embodiments of the present disclosure. Inthe embodiment shown in FIG. 3, the memory device 303 includes a memory304 (e.g., NAND flash array) and may include other control circuitrysuch as I/O control 318 and control logic 320. While memory 304 is shownbeing a NAND flash array, embodiments of the present disclosure are notso limited, and may include other types of memory, as well differentmemory arrangements and/or internal divisions (e.g., planes, blocks,pages, etc.)

I/O connections 327 and control connections 329 comprise a communicationinterface between a memory access device (e.g., 205 in FIG. 2) and thememory device 303. According to one or more embodiments, memory device303 may be configured (e.g., with pins, pads, contacts, etc.) to receivecombined or separate data, command, and address signal lines However,data, commands, and addresses may all be multiplexed onto common signalpaths (e.g., as shown in FIG. 3 at 326) and received by I/O control 318.

Addresses received by I/O control 318 may be latched by an addressregister 344 and communicated to a row decoder 352 to select a rowaddress, and/or to a column decoder 350 to select a column address, ofthe NAND flash memory array 304. Data may be transferred to or from theNAND flash memory array 304, byte by byte, for example through a cacheregister 354 and data register 356. The cache register 354 is nearest toI/O control 318, and acts as a data buffer for I/O data. The dataregister 356 is nearest to the memory array 304, and acts as a databuffer for the memory array 304.

Row and column addresses are communicated by the address register (e.g.,buffer) 344 for decoding by a row address decoder 352 and a columnaddress decoder 350, respectively. Memory array I/O control 318 iscoupled to the memory array (e.g., 304) via an I/O data bus. Write dataare applied to the memory array 304 through a data input buffer (e.g.,cache register 354) and the memory array read/write circuitry (e.g.,data register 356).

I/O control 318 generates internal control signals within the memorydevice 303 to carry out various memory operations. The control signalsmay be coded digital values (e.g., binary codes, hexadecimal codes,etc.) For example, a register bit (e.g., flag) may be used to indicatestatus of a control signal, or a hexadecimal code may be communicatedover an I/O path to indicate a particular command of an instruction set.

Commands received by I/O control 318 may be latched by a commandregister 324 and transferred to control logic 320 for generatinginternal signals to control memory device operations. Age information(e.g., wear cycle information, wear state information) may be latched bya block age register 345 and transferred to control logic 320 forgenerating the internal signals to control memory device operations.Control logic 320 receives latched memory commands (e.g., through signallines and/or a command bus 322). For example, control logic 320 mayreceive various signals such as a status bit (e.g., flag) set in acommand register 324. Control logic 320 similarly receives latched ageinformation through signal lines, a data bus, as status bits or flags,as will be understood by those with ordinary skill in the art.

The control logic 320 responds to memory commands and block ageinformation applied through the command register 324 and block ageregister 345 respectively, to perform various operations on the memoryarray 304. According to one or more embodiments, control logic 320determines one or more operating parameters based on the block ageinformation to perform various operations on the memory array 304.

In a read operation, the data read from the memory array 304 istransferred to the output buffer (e.g., data register 356) andcommunicated on the data I/O lines. In a write operation, the addressedmemory cell is accessed and data is communicated on the data I/O linesto the data input buffer (e.g., data register 356 through the cacheregister 354) to be stored in the memory array 304.

According to one or more embodiments of the present disclosure, and asshown in FIG. 3, memory 304 is a high speed NAND Flash array device. Thecommunication interface (e.g., 329 and 327) between a memory accessdevice (e.g., 205 in FIG. 2) and memory 304 can be operated in asynchronous mode to achieve faster I/O operations, or in an asynchronousmode for compatibility with slower NAND Flash devices. The communicationinterface may use a highly multiplexed 8-bit bus 326 (DQ[7:0]) totransfer commands, addresses, and data. Data transfers in thesynchronous mode include a bidirectional data strobe (DQS) 328.

According to one or more embodiments, between the synchronous andasynchronous modes, a number of signals are used to implement a NANDFlash protocol. In the asynchronous mode, these signals include a chipenable (CE#) signal on a CE# signal line 330, command latch enable (CLE)signal on a CLE signal line 332, address latch enable (ALE) signal on aALE signal line 334, write enable (WE#) signal on a WE# signal line 336,and read enable (RE#) signal on a RE# signal line 338. Additionalsignals control hardware write protection (e.g., the write protection(WP#) signal on the WP# signal line 340) and monitor device status(e.g., the ready/busy (R/B#) signal on the R/B# signal line 342). As oneof ordinary skill in the art will appreciate, the “#” symbol indicates aparticular signal being active in a LOW logic state.

The CE# signal enables or disables one or more logical units (e.g., an 8Gb block of memory 304) when the communication interface is operating inasynchronous mode. The CLE signal is used to load a command from the bus326 (DQ[7:0]) into the command register 324. The ALE signal is used toload an address from the bus 326 (DQ[7:0]) into an address register 344.The WE# signal transfers commands, addresses, and serial data from amemory access device (e.g., processor) memory controller, controlcircuitry, host system, etc., to the memory 304 when the communicationinterface is operating in asynchronous mode. The RE# signal transfersserial data from the memory 304 to a host system when the communicationinterface is operating in asynchronous mode. The WP# signal enables ordisables memory 304 programming and erase operations when thecommunication interface is operating in asynchronous mode. These signalsare discussed further in reference to FIG. 4.

FIG. 4 shows timing waveforms associated with operating memory cells, inaccordance with one or more embodiments of the present disclosure.Various control signals coordinate communication of a command, addressand other information, and data across a memory interface. In accessingone or more memory cells, a memory access device communicates accessinginformation that includes control signals and a command set. In generalterms, a command set includes a command to be accomplished, an addressin memory, and the data associated with the memory location and/orcommand.

A write command set can include communicating, on a multiplexed bus, aninitial command, followed by address information, and then by the data.In an asynchronous mode, the command, address information, and data maybe latched on the rising edge of the WE# signal, for example. A readcommand set can include communicating, on the multiplexed bus, aninitial command, followed by address information, and then by theread-out data. By way of example, the waveforms shown in FIG. 4 areassociated with a write operation, communicated in an asynchronous mode.

Communicating a command set includes communicating at least one commandcycle and at least one address cycle. According to one or moreembodiments of the present disclosure, communicating the command setincludes transmitting at least one command cycle that includes wearcycle information and/or wear state information. According to one ormore embodiments of the present disclosure, communicating the commandset includes transmitting at least one address cycle that includes wearcycle and/or state information.

As will be appreciated by one having ordinary skill in the art, certainsignal lines may be used for asynchronous data transfer. Additional orother signals and/or signal lines may be used for synchronous datatransfer. Embodiments of the present disclosure are not limited to theasynchronous communication implementation described below and shown inFIG. 4. Signals associated with an asynchronous communication techniqueare used for illustration of one implementation method. One skilled inthe art will appreciate how the present disclosure may be implementedusing other communication techniques (e.g., synchronous, etc.)

According to one or more embodiments, a number of signals are used toimplement a NAND flash communication protocol 460, as previouslydescribed. In the asynchronous mode and as shown in FIG. 4, thesesignals include a CLE signal 461, a CE# signal 462, a WE signal 463, anALE signal 464, and a RE# signal 466. One or more additional signalscontrol hardware write protection (WP#—not shown), and monitor devicestatus (e.g., a ready/busy (R/B#) signal 465). As one skilled in the artwill appreciate, the “#” symbol indicates a particular signal beingactive in a LOW logic state.

When the communication between a memory device (e.g., 203 in FIG. 2) anda memory access device (e.g., 205 in FIG. 2) is asynchronous, the memorydevice (e.g., 203 in FIG. 2) is not driven by an external clock. The WE#signal 463 is used to provide a timing reference to the memory device(e.g., 203 in FIG. 2). Timing chains that are activated by the controlsignals (e.g., ALE 464 and CLE 461) are used to control the timing ofthe communications transfer. The memory access device (e.g., 205 in FIG.2) uses control signals to indicate to the memory device (e.g., 303 inFIG. 3) when requests for data transactions are sent, and the datatransfers are performed asynchronously.

Referring to the circuit shown in FIG. 3, as well as the waveforms shownin FIG. 4, the CE# signal 462 is active LOW and enables or disables oneor more logical units (e.g., a block) of memory 304 when a communicationinterface is operating in asynchronous mode. The CLE signal 461 isactive HIGH and used to load a command from the bus 326 (DQ[7:0]) intothe command register 324. Information on bus 326 is represented in FIG.4 by the waveform labeled I/Ox 467. The ALE signal 464 is active HIGHand used to load an address from the bus 326 (DQ[7:0]) into an addressregister 344, and wear cycle information from the bus 326 (DQ[7:0]) intoa block age register 345. The WE# signal 463 transfers commands,addresses and other information, and serial data from a memory accessdevice (e.g., processor 205 shown in FIG. 2, firmware, memorycontroller, control circuitry, host system, etc.) to the memory 304 whencommunication interface is operating in asynchronous mode.

The RE# signal 466 is active LOW and signals transfer of serial datafrom the memory 304 to the host system. Note that in FIG. 4, the RE#signal 466 is shown HIGH (i.e., not active, since the signal is activeLOW), as the waveforms shown in FIG. 4 are associated with a writeoperation.

A write command set is used to write data to the memory device. Thewrite command 471 is communicated on the bus (e.g., I/Ox 467 in FIG. 4)during an initial command cycle, with the CLE signal 461 being in a HIGHlogic state corresponding to a rising edge of the WE# signal 463.According to one or more embodiments of the present disclosure, otherinformation, such as wear cycle and/or wear state information, may becommunicated on the bus (e.g., I/Ox 667 in FIG. 4) during the commandcycles 471.

Address and age information (e.g., wear cycle information, wear stateinformation) may be communicated on the bus (e.g., I/Ox 667 in FIG. 4)during the address cycles 472, with the ALE signal 464 being in a HIGHlogic state corresponding to a rising edge of the WE# signal 463. Datacycle(s) (not shown in FIG. 4), associated with the command and/oraddress(es), follow the address cycles 472 on the bus, being latched ona rising edge of the WE# signal 463. The RE# (i.e., read enable) signal466 is in an unasserted (e.g., HIGH) logic state during the asynchronouswrite operation.

The signals indicated in FIG. 4 correspond to one method forimplementing embodiments of the present disclosure. It will beappreciated by those ordinarily skilled in the art that changes to theparticular signals communicated to/from the memory interface, as shownin FIG. 4, will not depart from the scope of the present disclosure.

Address information communicated during the address cycles 472, andlatched in address register 344 is further directed to a column decode350 and/or a row decode 352, which in turn, drives selection of one ormore memory cells of memory 304. Data I/O information is written to/readfrom memory 304 through a cache register 354 and data register 356.Control logic 320 loads status information into a status register 358,which may be further communicated to I/O control 318. Wear cycle/stateinformation communicated during the address cycles 472, or commandcycles 471, may be latched in block age register 345, and furtherdirected to control logic 320.

Memory cell operational performance changes as the quantity ofprogram/erase cycles increase. The reader will appreciate that certainperformance characteristics and changes thereto, may be accommodatedwith adjustments made to one or more operating parameters (e.g.,voltages, durations, pulse quantities, etc.) associated with programmingfor an array of non-volatile memory cells (e.g., array 100) as a meansfor extending its useful life. According to one or more embodiments ofthe present invention, memory cell operating parameters are determinedin response to wear cycle information and/or wear state informationreceived by the memory device 303 from the memory access device (e.g.,205 in FIG. 2).

Determining (e.g., selection, setting, adjustment, etc.) can includemeasures to counteract degradation, and/or to adapt to new performancecharacteristics more suitable to memory cells of a given age. Forexample, the quantity of erase pulses used to place memory cells in anerased state can be increased in response to slower erase operationsbased on age, or programming voltages can be adjusted to accommodateprogramming performance changes as memory cells age. Further discussionof memory cell operational performance is provided in co-pending,co-assigned U.S. patent application Ser. No. 11/414,966, entitled,“Memory Voltage Cycle Adjustment”, filed on May 1, 2006, and co-pending,co-assigned U.S. patent application Ser. No. 11/876,406, entitled,“Memory Cell Operation”, filed on Oct. 22, 2007, each having commoninventorship.

FIG. 5A is a table illustrating an address data arrangement organizedinto 5 cycles, in accordance with one or more embodiments of the presentdisclosure. The data arrangement shown in FIG. 5A, includes informationtransmitted during the address cycles (e.g., 472 in FIG. 4) arrangedinto five (5) 8-bit portions (e.g., five address cycles). The dataarrangement shown in FIG. 5A may be communicated across an 8-bit bususing five address cycles. Embodiments of the present disclosure are notlimited to this configuration, and may be arranged to have a differentword length (e.g., 16 bits), including more or less bits per word so asto comprise more or fewer address cycles.

The data arrangement shown in FIG. 5A is configured for compatibilitywith legacy read, program (e.g., write, erase) commands, and includes anumber of unused bits (shown set LOW in FIG. 5A). According to one ormore embodiments of the present disclosure, one or more of the otherwiseunused bits of the address cycles are used to represent age information(e.g., wear cycle information, wear state information) corresponding tothe memory cell(s) being addressed within the address cycles. Accordingto one or more embodiments of the present disclosure, wear cycle and/orwear state information, are included in the address cycle communicatedlast in time; however, embodiments of the present disclosure are not solimited. The address cycle communicated last in time may (as shown inFIG. 5A), or may not (as shown in FIG. 5B), include a portion of theaddress-identifying information for the portion of the memory cells towhich the command set applies.

According to one or more embodiments of the present disclosure, wearcycle and/or wear state information, are included in the command cyclecommunicated last in time; however, embodiments of the presentdisclosure are not so limited. The command cycle communicated last intime may, or may not, include a portion of the command-identifyinginformation for the portion of the memory cells to which the command setapplies.

For example, and as shown in FIG. 5A, the three upper, i.e.,most-significant, available bits of the fifth address cycle may be usedto convey age information (e.g., by representing a wear cycle quantity,a wear state determined from wear cycle quantity, one or moreage-related status flags, other information that represents to thememory device a performance-related age classification).

By including age information within a legacy-compatible quantity ofaddress cycles (or command cycles), using otherwise unused or availablebits within a pre-existing quantity of address cycles (or commandcycles), additional memory functionality may be added while retainingcompatibility with a legacy system, software, and/or communicationprotocol. While 3 bits are shown in FIG. 5A being used to represent theage information of the one or more memory cells (e.g., a block)embodiments of the present disclosure are not so limited. That is,embodiments of the data arrangement of the present disclosure mayutilize more or fewer bits to represent a memory cell age thatcorresponds to the memory cells being accessed (e.g., written to, readfrom, erased, etc.) For example, one bit may be used to indicate one oftwo wear states, which may be used to toggle the memory devicetherebetween.

The address cycles (or command cycles) containing age information arereceived from the memory access device (e.g., 205 in FIG. 2) by the I/Ocontrol (e.g., 318 in FIG. 3) of the memory device (e.g., 303 in FIG.3). The age information (e.g., wear cycle/state information) can beextracted from the address cycles, latched into the block age register(e.g., 345 in FIG. 3) and further communicated to the control logic(e.g., 320 in FIG. 3) for use as previously described.

The control logic (e.g., 320 in FIG. 3) can be programmed so as torelate wear cycle/state information pertaining to the memory cells beingoperated (e.g., some portion of memory array such as 304 in FIG. 3) andthe performance characterization of the memory cells as a function ofwear cycle/state information. For example, the control logic (e.g., 320in FIG. 3) may be configured to (e.g., programmed) operate responsive tomemory cell performance changes due to age, such as the drift in Vt.According to one or more embodiments of the present disclosure, controllogic (e.g., 320 in FIG. 3) may be configured to determine one or moreoperating parameters for the portion of the memory cells, at leastpartially in response to wear cycle/state information received. Forexample, at least one operating parameter may be determined based atleast partially on wear cycle/state information and a predetermined Vtdrift curve information stored in the memory device, the Vt drift curveinformation characterizing the performance of the memory cells as afunction of age (e.g., wear cycle, wear state).

A memory device of the same type, or manufacture, as the memory devicebeing operated may be tested to determine age related performancecharacteristics. For example, a Vt drift curve versus wear cycles may beascertained from testing Vt levels as a function of wear cycles.Measurements may be taken to determine performance characteristicsversus age for different memory types, sizes, manufacture, or otherconfigurations. Then, a similar memory device may be programmed with theperformance characteristics versus age (e.g., wear cycle, wear state) ina manner that allows the memory device to determine one or moreoperating parameters based on age information received from a memoryaccess device. For example, Vt drift data for a NAND flash memory devicemay be characterized, and embedded into the NAND memory device. Thisdata may be arranged in a data arrangement such as a data table, or maybe implemented by execution of a stored function or computation, or maybe implemented in firmware, for determining the operational parameterusing an age-related input (e.g., wear cycle, wear state).

The wear cycle/state information may be communicated to the NAND devicecontroller (e.g., I/O control such as 318 in FIG. 3) and/or controllogic (e.g., 320 in FIG. 3) as part of access information (e.g., commandand/or address data) transferred to the NAND device during commandand/or address cycles. Thereafter, given the wear cycle/state,information, control logic (e.g., 320 in FIG. 3) is configured todetermine (e.g., select, set, adjust) one or more operating parametersfor the portion of memory cells being operated. In this manner, a NANDflash memory device control logic (e.g., 320 in FIG. 3) may applyappropriate read, program (e.g., write, erase) timing, duration ormagnitude, based on a block age (e.g., wear cycle information, wearstate information) to improve performance and durability.

As previously mentioned, a memory access device (e.g., 205 in FIG. 2)may determine (e.g., count, track, record) wear cycles for each givenportion of memory. According to one or more embodiments of the presentdisclosure, solid state drive (SSD) may be configured to have firmware,or a processor executing software, to implement keeping track of erasecounts for each NAND device block. Thereafter, the erase counts arecommunicated (e.g., as wear cycle information, wear state information)for each read, program and/or erase operation to the memory device.Embodiments are not limited to being implemented for block-size units ofmemory, and may be implemented for individual memory cells, or anyquantity thereof.

As a memory device ages, controlled read, write and erase timing andvoltages can contribute to a prolonged life, since application ofcertain voltage magnitudes and/or pulse quantities or frequencies tendto affect the amount of trapped charge for example. If memory cell errorrates are reduced, and/or program and erase operations accomplished morequickly, less processor time is spent in error handling and otherrepetitive actions. Performance improvements may be attained byadjusting read, program (including erase) times corresponding to blockage (e.g., shortening when young, lengthening when old) to accommodatethe actual performance changes occurring in the memory device.

Wear cycle/state information may also be used to switch a memory devicebetween a safe (e.g., high reliability) operating mode and a fast (e.g.,high speed) operating mode. According to one or more embodiments, thesafe operating mode operates with more reliability but at a slower speedrelative to the high performance operating mode, and the highperformance operating mode operates with faster speed but with lessreliability relative to the safe operating mode. For example, one ormore operating parameters associated with a “safe” wear state may bedetermined and stored in the memory device. Then by receiving wear stateinformation corresponding to the “safe” wear state, the memory controllogic may determine operating parameter(s) in operating the memory cellsbeing accessed (e.g., for read, program, erase operations). One skilledin the art will appreciate that in this manner certain areas of a memorydevice may be operated according to safe operating parameters (e.g., ifa safe wear state always accompanies operations to that area of thememory device regardless of age).

Upon receiving age information, the control logic (e.g., 320 in FIG. 3)can determine operating parameters (e.g., Vt drift) corresponding to theage information received. If no age information is received during theaddress cycles, the control logic (e.g., 320 in FIG. 3) may utilizedefault operating parameters to operate the memory cells. Conversely, ifage information is sent by the memory access device (e.g., 205 in FIG.2) but the control logic (e.g., 320 in FIG. 3) does not include such agecompensation functionality, or is unable to comprehend or properly applysuch age information, then the age information included in that addresscycles may be ignored. In this manner, techniques of the presentdisclosure may retain compatibility with legacy devices and methods thatdo not include certain age compensation functionality.

One skilled in the art will appreciate the advantages, and limitations,in using available (e.g., otherwise unused) bits of an establishedquantity of address cycles. The upper (e.g., most significant) bits ofaddress cycle five may be ignored if the memory device does not supportthe wear cycle/state functionality.

FIG. 5B is a table illustrating another address data arrangementorganized into 6 cycles, in accordance with one or more embodiments ofthe present. disclosure. The data arrangement shown in FIG. 5B issimilar to the data arrangement shown in FIG. 5A; however, severalchanges as described below are included. First, the most-significantbits of the fifth address cycle are not used to represent wearcycle/state information. Instead, the most-significant bits of the fifthaddress cycle remain unused (e.g., set LOW) and a sixth address cycle isadded containing wear cycle information and/or wear state information.For example, the four most-significant bits of the sixth (additional)address cycle may be used to communicate the age of the memory blockbeing referenced by the address(es) communicated in the first fiveaddress cycles.

A data arrangement, according to one or more embodiments of the presentdisclosure, includes a first quantity of bits representing addressinginformation corresponding to a portion of a memory device, and a secondquantity of bits representing wear cycle/state information correspondingto the portion of a memory device. The first and second quantity of bitsare communicated in N address cycles, which are communicated from amemory access device to the memory device. According to one or moreembodiments, the last (i.e., Nth) address cycle includes the secondquantity of bits.

According to one or more embodiments, the second quantity of bits may bearranged as the one or more most significant bits of the Nth addresscycle. However, embodiments of the present disclosure are not solimited, and wear cycle/state information need not be exclusivelyconfined to the most significant bits. For example, one bit may be usedto represent an age flag, and this bit may be communicated in the lastaddress cycle by other than the most significant bit of the addresscycle. So too, may age information (e.g., a flag) be communicated by abit of an address cycle other than the last address cycle.

As the reader will appreciate, the second quantity of bits may becontained in the last address cycle, with or without, any bits of thefirst quantity of bits. That is, the second quantity of bits may becontained in the last address cycle along with (shown in FIG. 5A), orwithout (shown in FIG. 5B), a portion of the first quantity of bits.

One skilled in the art will appreciate that some memory devices utilize3 or 5 address cycles in addressing memory cells. One skilled in the artwill also appreciate the benefit in maintaining compatibility with this3 or 5 address cycle protocol by including the wear cycle informationand/or wear state information in the existing 3 or 5 address cycles(e.g., by making use of the otherwise unused data bits). So too, willone skilled in the art appreciate the benefit in including the wearcycle information and/or wear state information in an additional addresscycle (e.g., thus allowing more bits in the 3 or 5 address cycles to beused for addressing information). As previously mentioned, wear cycleinformation and/or wear state information is not limited to inclusion inaddress cycles, and may be included in existing, or additional, commandcycles, as appropriate with system compatibility considerations.

FIG. 6 is a functional block diagram of a memory module having at leastone memory device operated in accordance with one or more embodiments ofthe present disclosure. Memory module 693 is illustrated as a memorycard, although the concepts discussed with reference to memory module693 are applicable to other types of removable or portable memory (e.g.,USB flash drives) and are intended to be within the scope of “memorymodule” as used herein. In addition, although one example form factor isdepicted in FIG. 6, these concepts are applicable to other form factorsas well.

In one or more embodiments, memory module 693 will include a housing 694(as depicted) to enclose one or more memory devices 695, though such ahousing is not essential to all devices or device applications. At leastone memory device 695 includes an array of non-volatile multilevelmemory cells that can be sensed according to embodiments describedherein. Where present, the housing 694 includes one or more contacts 696for communication with a host device. Examples of host devices includedigital cameras, digital recording and playback devices, PDAs, personalcomputers, memory card readers, interface hubs and the like. For one ormore embodiments, the contacts 696 are in the form of a standardizedinterface. For example, with a USB flash drive, the contacts 696 mightbe in the form of a USB Type-A male connector. For one or moreembodiments, the contacts 696 are in the form of a semi-proprietaryinterface, such as might be found on CompactFlash™ memory cards licensedby SanDisk Corporation, Memory Stick™ memory cards licensed by SonyCorporation, SD Secure Digital™ memory cards licensed by ToshibaCorporation and the like. In general, however, contacts 696 provide aninterface for passing control, address and/or data signals between thememory module 693 and a host having compatible receptors for thecontacts 696.

The memory module 693 may optionally include additional circuitry 697,which may be one or more integrated circuits and/or discrete components.For one or more embodiments, the additional circuitry 697 may includecontrol circuitry, such as a memory controller, for controlling accessacross multiple memory devices 695 and/or for providing a translationlayer between an external host and a memory device 695. For example,there may not be a one-to-one correspondence between the number ofcontacts 696 and a number of 695 connections to the one or more memorydevices 695. Thus, a memory controller could selectively couple an I/Oconnection (not shown in FIG. 6) of a memory device 695 to receive theappropriate signal at the appropriate I/O connection at the appropriatetime or to provide the appropriate signal at the appropriate contact 696at the appropriate time. Similarly, the communication protocol between ahost and the memory module 693 may be different than what is requiredfor access of a memory device 695. A memory controller could thentranslate the command sequences received from a host into theappropriate command sequences to achieve the intended access to thememory device 695. Such translation may further include changes insignal voltage levels in addition to command sequences.

The additional circuitry 697 may further include functionality unrelatedto control of a memory device 695 such as logic functions as might beperformed by an ASIC. Also, the additional circuitry 697 may includecircuitry to restrict read or write access to the memory module 693,such as password protection, biometrics or the like. The additionalcircuitry 697 may include circuitry to indicate a status of the memorymodule 693. For example, the additional circuitry 697 may includefunctionality to determine whether power is being supplied to the memorymodule 693 and whether the memory module 693 is currently beingaccessed, and to display an indication of its status, such as a solidlight while powered and a flashing light while being accessed. Theadditional circuitry 697 may further include passive devices, such asdecoupling capacitors to help regulate power requirements within thememory module 693.

CONCLUSION

The present disclosure includes memory devices and systems having memorycells, as well as methods for operating the memory cells. One or moremethods for operating memory cells includes determining age informationfor a portion of the memory cells and communicating a command set forthe portion of the memory cells, the command set including the ageinformation.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of one or more embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of skill in the art uponreviewing the above description. The scope of the one or moreembodiments of the present disclosure includes other applications inwhich the above structures and methods are used. Therefore, the scope ofone or more embodiments of the present disclosure should be determinedwith reference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, some features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

What is claimed is:
 1. A method for operating memory cells of a memorydevice, comprising: receiving, by the memory device, a wear state forthe memory cells from a memory access device; determining, by the memorydevice, a set of operating parameters for the memory cells responsive tothe received wear state, wherein the wear state corresponds to aquantity of erase pulses used to accomplish a verified erasure of thememory cells.
 2. The method of claim 1, wherein receiving the wear stateincludes receiving the wear state from available bits within apre-existing legacy-compatible quantity of address cycles.
 3. The methodof claim 1, wherein receiving the wear state includes receiving wearcycle information from available bits within a pre-existinglegacy-compatible quantity of address cycles.
 4. The method of claim 1,wherein receiving the wear state includes receiving the wear state fromavailable bits within a pre-existing legacy-compatible quantity ofcommand cycles.
 5. The method of claim 1, wherein receiving the wearstate includes receiving wear cycle information from available bitswithin a pre-existing legacy-compatible quantity of command cycles. 6.The method of claim 1, the determined set of operating parameters causesthe memory cells to expend useful life at a different rate.
 7. Themethod of claim 1, wherein determining the set of operating parametersincludes determining at least one of a programming pulse voltagemagnitude, a programming pulse duration, a programming pulse frequency,and a quantity of programming pulses.
 8. A method for operating memorycells of a memory device, comprising: determining, by a memory accessdevice, a wear state for the memory cells; and communicating the wearstate from the memory access device to the memory device; anddetermining, by the memory device, a set of operating parameters for thememory cells in response to the determined wear state, whereindetermining the wear state for the memory cells includes evaluatingcharacteristics of the memory device corresponding to the wear state,and wherein evaluating characteristics of the memory devicecorresponding to the wear state includes measuring a quantity of erasepulses used to accomplish a verified erasure of the memory cells.
 9. Themethod of claim 8, wherein communicating the wear state includesproviding a quantity of wear cycles to the memory device with each readoperation.
 10. The method of claim 8, wherein communicating the wearstate includes providing a quantity of wear cycles to the memory devicewith each program operation.
 11. The method of claim 8, whereincommunicating the wear state includes providing a quantity of wearcycles to the memory device with each erase operation.
 12. The method ofclaim 8, further comprising compensating for memory device performancechanges corresponding to the wear state.
 13. A method for operatingmemory cells of a memory device, comprising: determining, by a memoryaccess device, a wear state for the memory cells; and communicating thewear state from the memory access device to the memory device; anddetermining, by the memory device, a set of operating parameters for thememory cells in response to the determined wear state, whereincommunicating the wear state from the memory access device to the memorydevice includes using available bits within a pre-existinglegacy-compatible quantity of address cycles to communicate the wearstate and/or wear cycle information.
 14. A method for operating memorycells of a memory device, comprising: determining, by a memory accessdevice, a wear state for the memory cells; and communicating the wearstate from the memory access device to the memory device; anddetermining, by the memory device, a set of operating parameters for thememory cells in response to the determined wear state, whereincommunicating the wear state from the memory access device to the memorydevice includes using available bits within a pre-existinglegacy-compatible quantity of command cycles to communicate the wearstate and/or wear cycle information.
 15. A memory device, comprising: anarray of memory cells; and control circuitry coupled to the array, andadapted to: receive a wear state for the memory cells from a memoryaccess device; and determine at least one operating parameter for thememory cells in response to the received wear state, wherein the wearstate corresponds to a quantity of erase pulses used to accomplish averified erasure of the memory cells.
 16. The method of claim 15,wherein the control circuitry is further adapted to determine the atleast one operating parameter so as to minimize an expected Vt drift fora particular wear state of the memory cells.
 17. The memory device ofclaim 15, wherein the control circuitry is further adapted to implementslower speed operation of the memory cells responsive to the receivedwear state.
 18. The memory device of claim 15, wherein the controlcircuitry is further adapted to implement higher reliability operationof the memory cells responsive to the received wear state.
 19. Thememory device of claim 15, wherein the control circuitry is furtheradapted to change at least one operating parameter for the memory cellsin response to the received wear state.
 20. The memory device of claim15, wherein the control circuitry is further adapted to compensate formemory device performance changes corresponding to the received wearstate.